The thermal resistance between the body of a power semiconductor device and the ambient is expressed as
A. voltage across the device divided by current through the device.
B. average power dissipated in the device divided by the square of the rms current in the device.
C. average power dissipated in the device divided by the temperature difference from body to ambient.
D. temperature difference from body to ambient divided by average power dissipated in the device.
Show Answer
Answer: D
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